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Title:
TRACK RAIL MOUNTING STRUCTURE OF LINEAR GUIDE DEVICE
Document Type and Number:
Japanese Patent JP2002349564
Kind Code:
A
Abstract:

To provide a track rail mounting structure of a linear guide device absorbing a difference of expansion/shrinkage caused by a difference in both heat expansion coefficients and generating no distortion of the track rail by a variation of temperature even in the case where a heat expansion coefficient of a material constituting the track rail of the linear guide device and a heat expansion coefficient of a material constituting a base mounted with the track rail are different.

The track rail mounting structure of the linear guide device is provided with the track rail 2 having a rolling surface on which the large number of rolling elements roll; and a movement member having an endless circulation passage for guiding the large number of rolling elements and movably provided on the track rail 2 through the rolling elements. A groove 12 for inserting a bottom part of the track rail 2 is provided on the base 10 mounted with the track rail 2 and the bottom part of the track rail 2 is inserted to the groove 12. A press member (corrugated sheet-like spacer 9) for pressing at least one side surface of the track rail to an inside surface of the groove and the track rail 2 is fixed to the groove 12.


Inventors:
SHIRAI TAKEKI
MICHIOKA HIDEKAZU
ISE TSURUJIRO
KISHI HIROAKI
Application Number:
JP2001164363A
Publication Date:
December 04, 2002
Filing Date:
May 31, 2001
Export Citation:
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Assignee:
THK CO LTD
International Classes:
B23Q1/00; B23Q1/26; B23Q1/58; F16C29/00; F16C29/06; F16C29/12; (IPC1-7): F16C29/06; F16C29/12
Domestic Patent References:
JPH07190056A1995-07-28
JPH05215131A1993-08-24
JPH11351256A1999-12-24
JPH1182431A1999-03-26
JPH04360703A1992-12-14
Attorney, Agent or Firm:
Takashi Kumagai (1 outside)