Title:
TRANSDUCER DEVICE AND MANUFACTURING METHOD THEREOF
Document Type and Number:
Japanese Patent JP2017108226
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To attain downsizing, facilitation of manufacture, and reduction of cost and to also widen a temperature use range.SOLUTION: An acoustic port 18 is formed on a silicon first substrate (first wafer) 16, and a back chamber 19 is formed on a silicon second substrate (second wafer) 17. A conversion part 23 including a movable electrode 21 and a stationary electrode 22, and a signal processing circuit 24 are mounted on the first substrate 16, for example, and the first substrate 16 and the second substrate 17 are overlapped and joined. Namely, an inner joint material 33a and an outer joint material 33b are disposed in a peripheral part of the first substrate 16, and the peripheral part of the first substrate 16 and a proximal end part that is an edge of the back chamber 19 on the second substrate 17 are made opposite to each other and joined by the joint materials 33a and 33b.SELECTED DRAWING: Figure 1
Inventors:
ARAKI SHINICHI
USUI TAKAHIDE
FUJII HIROKAZU
KONDO AKIRA
NEMOTO RYUHEI
USUI TAKAHIDE
FUJII HIROKAZU
KONDO AKIRA
NEMOTO RYUHEI
Application Number:
JP2015239005A
Publication Date:
June 15, 2017
Filing Date:
December 08, 2015
Export Citation:
Assignee:
NEW JAPAN RADIO CO LTD
International Classes:
H04R19/04; H04R31/00
Domestic Patent References:
| JP2015177376A | 2015-10-05 | |||
| JP2012175336A | 2012-09-10 |
Foreign References:
| US20110165717A1 | 2011-07-07 |
Attorney, Agent or Firm:
Yasuto Ogata
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