Title:
低温で転写加工可能な転写フイルム
Document Type and Number:
Japanese Patent JP7055940
Kind Code:
B2
Abstract:
To provide a transfer film capable of obtaining a transfer laminate which can efficiently and uniformly transfer heat of a heat source to an adhesive layer of a transfer film and a surface of a transferred object, and prevents appearance defects, adhesion defects, and transfer defects.SOLUTION: There is provided a transfer film in which at least a release layer, a metal thin film layer, and an adhesive layer are laminated in this order on a plastic film, in which the adhesive layer contains at least a resin, inorganic fine particles, and a thermal conductive material, and the thermal conductive material having high thermal conductivity is uniformly dispersed in the adhesive layer.SELECTED DRAWING: None
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Inventors:
Tomoya Maekawa
Soma Yuki
Soma Yuki
Application Number:
JP2017221716A
Publication Date:
April 19, 2022
Filing Date:
November 17, 2017
Export Citation:
Assignee:
Reiko Co., Ltd.
International Classes:
B44C1/17; B32B15/08; B32B33/00
Domestic Patent References:
| JP2007015205A | ||||
| JP2007212730A | ||||
| JP5238197A | ||||
| JP10264201A | ||||
| JP2005056906A | ||||
| JP2015077706A | ||||
| JP2005335319A | ||||
| JP2006096053A | ||||
| JP2007231459A | ||||
| JP10329170A |
Foreign References:
| KR1020090070219A |
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