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Title:
TRANSFER FOIL, AND MANUFACTURE OF ELECTROMAGNETIC SHIELDING MOLDING USING THE FOIL
Document Type and Number:
Japanese Patent JP2517505
Kind Code:
B2
Abstract:

PURPOSE: To manufacture an electromagnetic shielding molding with simplified processings by a method wherein a transfer foil made up by layering a plating preventing layer and a sticking layer over a peelable base sheet is put over the external face of a resin molding and is stuck thereto with heat pressure applied and after that, the base sheet is peeled off and electroless plating is applied to the resin molding.
CONSTITUTION: A base sheet 1 is made of polyethylene terephthalate film and after wax coating is applied thereto, a plating preventing layer 2 is formed of acrylic resin by gravure printing method and furthermore, a sticking layer 3 is made of vinyl chloride, vinyl acetate resin by gravure printing method, and thereby a transfer foil is manufactured. The transfer foil is placed along walls of a female mold of a metal mold 4 and molten acrylonitrile-butadiene- styrene resin is injected into the mold. After injection molding, a resin molding 5 is taken out and at the same time, the base sheet 1 is peeled off. After surface adjustment is made to the molding 5 and the molding is activated with catalyst given, the molding is immersed in solution for electroless copper plating, and thereby a plating layer 1 6 is formed to the inner surface of the molding.


Inventors:
Kentaro Fujii
Keiko Yoshihashi
Application Number:
JP34216091A
Publication Date:
July 24, 1996
Filing Date:
November 29, 1991
Export Citation:
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Assignee:
NISSHA PRINTING CO.,LTD.
International Classes:
B29C45/16; B29C45/00; B29C45/14; B44C1/17; B65D65/40; H05K9/00; B29K105/34; (IPC1-7): B44C1/17; B29C45/16; B65D65/40; H05K9/00
Domestic Patent References:
JP61225900A
JP1149970A



 
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