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Title:
TRANSFER MOLDING METHOD
Document Type and Number:
Japanese Patent JPH0629336
Kind Code:
A
Abstract:

PURPOSE: To improve throughput and yield.

CONSTITUTION: Sides of each cavity 2 are arranged at an inclined angle of substantially 45 degree with respect to a matrix pattern, and a gate 3 is coupled to one corner of the cavity 2 on an upper row. This corner is further coupled to one corner of another cavity 2 on a lower row through a communicating gate 4 extending across the corners of these two cavities that are close and opposite to each other. The gate 4 enables the upper and lower cavities 2 to be connected with each other, and hence the transfer velocity of resin can be increased, whereby a throughput can be improved. Each of the upper and lower cavities 2 can be filled with resin in one angle direction, and hence the spreading of the resin is improved. Thus, it is possible to prevent or suppress the occurrence of voids when the cavity is filled with resin.


Inventors:
OKADA SUMIO
SHIMIZU KAZUO
NAKAGAWA TAKASHI
Application Number:
JP17975792A
Publication Date:
February 04, 1994
Filing Date:
July 07, 1992
Export Citation:
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Assignee:
HITACHI LTD
International Classes:
H01L21/56; B29C45/26; (IPC1-7): H01L21/56
Attorney, Agent or Firm:
Akita Aki



 
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