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Patent Searching and Data


Title:
TRANSFER MOLDING METHOD
Document Type and Number:
Japanese Patent JPS6018321
Kind Code:
A
Abstract:

PURPOSE: To mold a plurality of kinds of resin in one closing, by providing a plurality of pieces of resin pouring systems consisting of a single space connecting with a plurality of molding spaces from the same resin pouring source in the same mold.

CONSTITUTION: Resin A is poured under a state wherein a pin 11 is risen. In this instance, while a pouring course 9 of resin B is interruped completely by the risen pin 11, a pouring course of the resin A is connected through a groove 13 provided on a top force and not interrupted by the pin 11. The resin A, therefore, does not enter into the pouring course 9, but poured through the pouring course 8 of the resin A without hindrance. When the resin A is cured, only a cylindrical pin 11 is lowered while a closing state is being kept on. As the pin 11 has lowered under this condition, the pouring course 9 of the resin B is connected through a space which has been occupied temporarily by the tip of the pin 11. The resin B is poured through the pouring course 9 under this condition. With this construction, pouring of different kinds of resin can be done in one closing.


Inventors:
SHIMIZU TAKESHI
KOSAKA HIDEKI
Application Number:
JP10457584A
Publication Date:
January 30, 1985
Filing Date:
May 25, 1984
Export Citation:
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Assignee:
HITACHI LTD
International Classes:
H01L21/56; B29C45/02; B29C45/16; (IPC1-7): B29C45/02; B29C45/16; H01L21/56
Attorney, Agent or Firm:
Katsuo Ogawa