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Patent Searching and Data


Title:
I/O TRANSIT BOARD OF MAGNETIC HEAD
Document Type and Number:
Japanese Patent JPH07153042
Kind Code:
A
Abstract:

PURPOSE: To make an automated soldering process easy by a method wherein narrow copper foil parts are provided in a pair of copper foil patterns and heat transmission speeds in both the copper foil patterns are made to be approximately equal to each other.

CONSTITUTION: The area (s) of a copper foil 2a-1 and the area (s') of a copper foil 2b-1 have a relation: s=0.9-1.1s'. The area (v) of a copper foil 2a-3 and the area (v') of a copper foil v' have a relation: v=0.9-1.1v'. The width (u) of a copper foil 2a-2 and the width (r) of a copper foil 2a-1 have a relation: u=0.2-0.8r. The width (u') of a copper foil 2b-2 and the width (r') of a copper foil 2b-1 have a relation: u'=0.2-0.8r'. The thickness of the copper foil patterns 2a and 2b of copper foil parts are same. If the above mentioned conditions are satisfied, a heat transmission speed from the copper foil 2a-1 to the copper foil 2a-2 and a heat transmission speed from the copper foil 2b-1 to the copper foil 2b-2 are approximately equal to each other. A heat transmission speed from a copper foil 2a-3 to the copper foil 2a-2 and a heat transmission speed from a copper foil 2b-3 to the copper foil 2b-2 are also approximately equal to each other.


Inventors:
OOMORI SHINGO
Application Number:
JP29822593A
Publication Date:
June 16, 1995
Filing Date:
November 29, 1993
Export Citation:
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Assignee:
SANYO ELECTRIC CO
International Classes:
G11B5/53; H05K1/11; H05K3/34; (IPC1-7): G11B5/53; G11B5/53
Attorney, Agent or Firm:
Takuji Nishino