Title:
TRANSMISSION CIRCUIT ELEMENT
Document Type and Number:
Japanese Patent JPS6211301
Kind Code:
A
Abstract:
PURPOSE: To miniaturize the constitution of a BPF of a transmission circuit element by laminating alternately a metallic thin film chip and an insulator thin film chip.
CONSTITUTION: The metallic thin film chip 2 and the insulating thin film chip 3 forming the BPF are laminated alternately on a dielectric substrate 1 and the thin film chips 2 opposing to each other are shifted by the 1/2 operating wavelength. The occupied area is less than the case with the arrangement of the metallic thin film chips as a plane on the dielectric substrate through the lamination above and the constitution of the BPF of the transmission circuit element is miniaturized.
Inventors:
TSUKADA KOJI
KAZUMURA MASARU
HAGIO MASAHIRO
KATSU SHINICHI
KAZUMURA MASARU
HAGIO MASAHIRO
KATSU SHINICHI
Application Number:
JP15079685A
Publication Date:
January 20, 1987
Filing Date:
July 09, 1985
Export Citation:
Assignee:
MATSUSHITA ELECTRONICS CORP
International Classes:
H01L21/768; H01L23/522; H01P1/203; H01P3/08; H01P11/00; (IPC1-7): H01L21/88; H01P1/203; H01P3/08; H01P11/00
Attorney, Agent or Firm:
Toshio Nakao