TRANSMISSION LINE SUBSTRATE FOR HIGH FREQUENCY

Japanese Patent JP3922551

B2

PROBLEM TO BE SOLVED: To provide a transmission line substrate for high frequency which prevents short-circuit between a metal conductor line and a metal conductor pattern, prevents contamination of a pad section of the metal conductor line and reduces deterioration of transmission characteristics.
SOLUTION: In the transmission line substrate 10 for high frequency having the metal conductor line 12 for passing a high frequency signal and the metal conductor pattern 13 for ground to be arranged on the same surface by providing intervals, one end of the metal conductor line 12 consists of a connecting section 15 for performing wax joining of connector core wire 14 of a coaxial connector 29 by a low-temperature wax material 16 and the pad section 17 for connecting the other end with a semiconductor element, an interval between the connecting section 15 and the metal conductor pattern 13 is larger than an interval between the pad section 17 and the metal conductor pattern 13 and moreover, a flow stopping pattern 18 to be formed by metal which can inhibit wax flow and form electric capacity is provided between the connecting section 15 and the pad section 17.

Noboru Kubo
Hideaki Itakura

JP2002206422A

May 30, 2007

July 16, 2002

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Sumitomo Metal Electro Device Co., Ltd.

H01L23/12; H01P5/08; (IPC1-7): H01P5/08; H01L23/12

JP10004155A
JP1276901A
JP9312507A
JP64005102A
JP7211846A
JP2000195619A
JP60103903U
JP2038806U
JP2002016163A
JP3278588A

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