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Title:
透明導電性カバーテープ
Document Type and Number:
Japanese Patent JP7028016
Kind Code:
B2
Abstract:
To provide a transparent conductive cover tape which has sufficient seal strength and stable easy peelability, and exhibits excellent antistatic properties that are applicable to packaging an electronic component while holding high transparency.SOLUTION: A transparent conductive cover tape for being heat-sealed to a carrier tape is formed by laminating a base material film 1, an adhesive layer 2, a first intermediate layer 3a, a second intermediate layer 3b and a heat seal layer 4 in this order, in which the first intermediate layer is a layer formed of a polyethylene-based resin, the second intermediate layer is a layer formed of a resin composition containing an ethylene-α-olefin copolymer and a styrene-butadiene block copolymer, the first intermediate layer and the second intermediate layer are layers formed by a co-extrusion method, the heat seal layer is a layer formed of a transparent conductive heat seal material in which conductive fine particles are dispersed in the acrylic resin, and the conductive fine particles are particles of zinc oxide doped with aluminum.SELECTED DRAWING: Figure 1

Inventors:
Ayu Murata
Tominaga Nobuyuki
Yasuya Iio
Toshiyuki Endo
Application Number:
JP2018059163A
Publication Date:
March 02, 2022
Filing Date:
March 27, 2018
Export Citation:
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Assignee:
Dai Nippon Printing Co.,Ltd.
International Classes:
B32B27/30; B32B25/16; B32B27/18; B32B27/32; B65D65/40; B65D73/02; B65D85/86
Domestic Patent References:
JP8253317A
Foreign References:
WO2012137630A1
Attorney, Agent or Firm:
Junji Yuda
Noriyuki Takebayashi