Title:
TRANSPARENT HEAT-RESISTANT RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH04332745
Kind Code:
A
Abstract:
PURPOSE:To provide a composition improved in the transparency and heat resistance for AS resin, also good in moldability similar to that of AS resin. CONSTITUTION:The objective composition comprising (A) an AS resin containing 10-28wt.% of acrylonitrile and (B) a heat-resistant acrylic resin made from (1) 65-90wt.% of methyl methacrylate, (2) 5-20wt.% of styrene and (3) 5-15wt.% of maleic anhydride. The present composition is excellent in heat resistance, transparency and moldability, therefore, being useful for automotive tail lamps, etc.
Inventors:
KOBAYASHI YASUO
AINE HIROSHI
AINE HIROSHI
Application Number:
JP10431491A
Publication Date:
November 19, 1992
Filing Date:
May 09, 1991
Export Citation:
Assignee:
DAICEL CHEM
International Classes:
C08L25/12; C08L33/00; C08L33/04; C08L33/12; C08L35/00; (IPC1-7): C08L25/12; C08L33/12; C08L35/00