Title:
Transparent porous material for chemical machinery polish
Document Type and Number:
Japanese Patent JP5986268
Kind Code:
B2
Abstract:
The invention is directed to a chemical-mechanical polishing pad substrate comprising a porous material having an average pore size of about 0.01 microns to about 1 micron. The polishing pad substrate has a light transmittance of about 10% or more at at least one wavelength of about 200 nm to about 35,000 nm. The invention is further directed to a polishing pad comprising the polishing pad substrate, a method of polishing comprising the use of the polishing pad substrate, and a chemical-mechanical apparatus comprising the polishing pad substrate.
Inventors:
Prasad, Avaneshwar
Application Number:
JP2015123439A
Publication Date:
September 06, 2016
Filing Date:
June 19, 2015
Export Citation:
Assignee:
CABOT MICROELECTRONICS CORPORATION
International Classes:
B24B37/24; B24B1/00; B24B29/00; B24B37/013; B24B37/10; B24B49/12; B24D7/12; C08J9/00; H01L21/304
Domestic Patent References:
| JP2001105299A | ||||
| JP2001062703A | ||||
| JP2001522316A | ||||
| JP2002265873A | ||||
| JP2000343411A | ||||
| JP2002124491A |
Foreign References:
| US6062968 | ||||
| US20020123300 |
Attorney, Agent or Firm:
Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Atsushi Ebiya
Naori Kota
Satoshi Deno
Kenji Kimura
Takashi Ishida
Tetsuji Koga
Atsushi Ebiya
Naori Kota
Satoshi Deno
Kenji Kimura
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