Title:
化学機械的研磨のための透明な多孔性材料
Document Type and Number:
Japanese Patent JP2006504260
Kind Code:
A
Abstract:
The invention is directed to a chemical-mechanical polishing pad substrate comprising a porous material having an average pore size of about 0.01 microns to about 1 micron. The polishing pad substrate has a light transmittance of about 10% or more at at least one wavelength of about 200 nm to about 35,000 nm. The invention is further directed to a polishing pad comprising the polishing pad substrate, a method of polishing comprising the use of the polishing pad substrate, and a chemical-mechanical apparatus comprising the polishing pad substrate.
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Inventors:
Prasad, Avaneshwar
Application Number:
JP2004546252A
Publication Date:
February 02, 2006
Filing Date:
October 06, 2003
Export Citation:
Assignee:
CABOT MICROELECTRONICS CORPORATION
International Classes:
H01L21/304; B24B1/00; B24B29/00; B24B37/24; B24B49/12; B24D7/12
Domestic Patent References:
| JP2001062703A | 2001-03-13 | |||
| JP2001105299A | 2001-04-17 | |||
| JPH10125634A | 1998-05-15 | |||
| JPH10166262A | 1998-06-23 |
Foreign References:
| US20010053658A1 | 2001-12-20 |
Attorney, Agent or Firm:
Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Nagasaka Tomoyasu
Masaya Nishiyama
Takashi Ishida
Tetsuji Koga
Nagasaka Tomoyasu
Masaya Nishiyama