搬送装置、搬送方法、ダイボンダ、およびボンディング方法

Title:

搬送装置、搬送方法、ダイボンダ、およびボンディング方法

Document Type and Number:

Japanese Patent JP7054315

Kind Code:

B2

Abstract:

Provided is a transport device comprising: a shuttle having an attraction mechanism and a heating mechanism and disposed in a feed position; a fed member transport mechanism for transporting a fed member to the shuttle; and a shuttle transport mechanism by which the shuttle having the fed member attracted thereto by means of the attraction mechanism is transported successively at a predetermined pitch to feed a fed portion of the fed member to a predetermined position. The heating mechanism of the shuttle forms a plurality of heat zones in which independent temperature control can be performed along the shuttle transport direction. The heat zones shift to a high-temperature region and a low-temperature region in accordance with the transport operation of the shuttle, wherein a heat zone corresponding to the predetermined position is designated a predetermined high-temperature region.

Inventors:

Yusuke Kubota

Application Number:

JP2020126474A

Publication Date:

April 13, 2022

Filing Date:

July 27, 2020

Export Citation:

Click for automatic bibliography generation Help