Title:
FLUID RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP3208888
Kind Code:
B2
Abstract:
PURPOSE: To obtain a fluid resin composition low in change of thixotropy with time and containing an epoxy resin.
CONSTITUTION: Magnesism silicate having 5 to 30μm average porticle diameter is further added to a fluid resin composition containing an epoxy resin, an inorganic filler and a thixotropy-imparting agent respectively in an amount of 5 to 15wt.%, ≤95wt.% and ≤5wt.% and further containing an organic solvent in a ratio of 15 to 35wt.% based on the total weight of the epoxy resin, the inorganic filler and the thixotropy-imparting agent.
Inventors:
Koji Nishimoto
Application Number:
JP1156593A
Publication Date:
September 17, 2001
Filing Date:
January 27, 1993
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
C08L63/00; C08K3/34; H01L23/29; H01L23/31; (IPC1-7): C08L63/00; C08K3/34
Domestic Patent References:
| JP63308025A | ||||
| JP384058A |
Attorney, Agent or Firm:
Fukami Hisaro (2 outside)