To provide a technique preventing a damage of a semiconductor device and a tray accommodating the same.
The tray for the semiconductor device has a pocket part 3 accommodating a substrate type package 6 (semiconductor device). The first guide members 8a to 8d are formed on the circumferential margin of the pocket part 3 so as to lie along the side surfaces 16a to 16d of the main body 9 of the substrate type package 6, and circular arc parts 18a to 18h are formed in predetermined areas of the inner wall parts (inner wall surfaces) 17a to 17d. By this even when the substrate type package 6 gets shaky during transporting the tray, the substrate type package 6 and the first guide members 8a to 8d surface-to-surface contact each other to disperse a load generated in both, and it is possible to prevent the damage of the tray for the semiconductor device and the substrate type package 6.
AKIYAMA KOSHO
TAKADA YOSUKE
KANAI MASAMITSU
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