Title:
TRAY FOR SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2688664
Kind Code:
B2
Abstract:
PURPOSE: To realize a low-cost tray for semiconductor devices in which the device can be contained without contact of a soldering ball with the tray and hence an inexpensive material can be used for the tray.
CONSTITUTION: In a tray containing a ball-grid array type semiconductor device, a number of pockets 2 with a similar figure, partitioned by upwardly extending taper ribs 3 with the widened base, and in which the part surrounded by the base of upwardly extending ribs is a little larger than the bottom face of the contained device, are provided on the upper face of tray. And similar recesses 9 of which plan shape is a little smaller than the bottom face of device and which is deeper than the height of soldering ball of the device, are provided on the bottom within the pockets to form a support step 10 bearing the peripheral edge of the device bottom face between the recess 9 and the base of upwardly extending rib and further, form protrusions 9a fitted in the clearances of soldering balls positioned at the outermost side of the bottom face of the contained device.
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Inventors:
Root
Application Number:
JP23950294A
Publication Date:
December 10, 1997
Filing Date:
September 07, 1994
Export Citation:
Assignee:
Shinon Electric Industry Co., Ltd.
International Classes:
B65D85/86; H01L21/673; (IPC1-7): B65D85/86; H01L21/68
Domestic Patent References:
| JP632384A |
Attorney, Agent or Firm:
Maeda Kiyomi