To provide a treating apparatus, in which a powdered substance contained in an exhaust gas discharged from a semiconductor manufacturing process can be removed efficiently and easily without using a large-sized or complicated constitution, and in which, further, much time and effort are not required in maintenance.

The treating apparatus is provided with an inlet of the exhaust gas, an exhaust of the treated gas, and a reservoir of the powdered substance, further, a partition to circulate the exhaust gas turning back in an up-and down direction, a partition to circulate the exhaust gas turning back in a horizontal direction, or a partition to circulate the exhaust gas spirally in the horizontal direction, and a cooling means of the above partitions.