To provide a treating apparatus and a treating method by which a stage in consideration of bending of a travel rail due to load of a die head or the like is provided, a gap between a die head and a substrate is uniformly held, and stable treatment can be performed.

In this treating apparatus, the stage on which the substrate is placed is constituted of a plurality of divided stages having three legs height of which can be adjusted. A treating section for treating the substrate is moved along rails provided at both sides of the stage. In this treating apparatus, before treatment of the substrate by the treating section, a gap between the substrate and the treating section is measured at the position of each leg of each segmentation stage and on the basis of the measured value, height of each leg is adjusted so that the gap becomes constant. By adjusting height of three legs, height and an angle of each divided stage are adjusted and the gap between the substrate and the treating section becomes constant.