Title:
銅酸化物還元用の処理液および処理方法
Document Type and Number:
Japanese Patent JP4191881
Kind Code:
B2
Abstract:
There are provided a treatment solution for reducing a copper oxide formed on the surface of copper to copper, wherein dimethylamine borane is contained in an amount of 0.3 to 2.0 g/L and the relationship y>=0.232x-0.185 holds between the concentration y (g/L) of dimethylamine borane and an area x (dm2/L) to be treated per unit solution amount, and a treatment method for reducing a copper oxide formed on the surface of a copper material to copper by dipping the copper material in the treatment solution as described above, wherein the addition of dimethylamine borane to water is carried out within 10 minutes before the dipping of the copper material or after the dipping of the copper material.
Inventors:
Koji Fujita
Kenji Ikeshima
Kenji Ikeshima
Application Number:
JP2000242412A
Publication Date:
December 03, 2008
Filing Date:
August 10, 2000
Export Citation:
Assignee:
Meltex Inc.
International Classes:
C23C22/63; C23C22/83; H05K3/38; C22B15/00
Domestic Patent References:
| JP2000502518A | ||||
| JP62270780A | ||||
| JP3082187A | ||||
| JP3129793A | ||||
| JP6209164A | ||||
| JP6330378A | ||||
| JP9288358A |
Attorney, Agent or Firm:
Junzo Yoneda
Hideo Sarada
Hideo Sarada
Previous Patent: 液体噴射装置
Next Patent: PICTURE REPRODUCING DEVICE, PICTURE INFORMATION STORAGE MEDIUM AND 'KARAOKE' PLAYER
Next Patent: PICTURE REPRODUCING DEVICE, PICTURE INFORMATION STORAGE MEDIUM AND 'KARAOKE' PLAYER