Title:
電解銅めっき方法に用いられるダミー材の処理方法
Document Type and Number:
Japanese Patent JP7145512
Kind Code:
B2
Abstract:
To effectively reuse a dummy material used in an electrolytic copper plating process.SOLUTION: A plating solution 21 is stored in a plating tank 20 used in an electrolytic copper plating process S4. A plating jig 10 is constituted of a rack 11 and an arm 12. A plating target substrate 1 and an a plate made from titanium or stainless steel as a dummy material 40 are attached to the plating jig. The plating jig 10 is disposed inside the plating tank 20 with a plating solution 21 stored therein. An electrode 13 made from copper is connected to the anode side of a DC power source 14, and the plating jig 10 is connected to the cathode side thereof.SELECTED DRAWING: Figure 9
Inventors:
Shun Hanaoka
Application Number:
JP2019201374A
Publication Date:
October 03, 2022
Filing Date:
November 06, 2019
Export Citation:
Assignee:
Hanaoka Metal Trading Co., Ltd.
International Classes:
C25D17/10; C25D1/20; C25D21/00
Domestic Patent References:
| JP8104998A | ||||
| JP10152799A | ||||
| JP2004176102A | ||||
| JP48031103A | ||||
| JP4162759A | ||||
| JP2015086444A |
Attorney, Agent or Firm:
Isshiki International Patent Service Corporation
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