Title:
WASHING/DRYING TREATMENT METHOD OF WAFER AND TREATMENT DEVICE THEREOF
Document Type and Number:
Japanese Patent JP3348053
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method which controls sticking particles to a wafer surface, dries a wafer surface rapidly without especially heating the wafer and uses only a little amount of organic solvent for drying when the wafer is washed with pure water and its surface is dried.
SOLUTION: Rising water flow is formed by supplying pure water into a washing tank 12, pure water is made to overflow from an overflow part of an upper part thereof, a wafer is immersed and washed in pure water in a washing tank, the wafer is pulled up from pure water after washing, and vapor of water soluble organic solvent with a function to lower surface tension of pure water to the wafer is supplied to a circumference of the wafer together with inert gas while the wafer is pulled up from the pure water.
Inventors:
Kazunori Fujikawa
Application Number:
JP27333699A
Publication Date:
November 20, 2002
Filing Date:
May 17, 1993
Export Citation:
Assignee:
Dainippon Screen Mfg. Co., Ltd.
International Classes:
B08B3/10; B08B3/04; F26B5/04; H01L21/304; (IPC1-7): H01L21/304; B08B3/04; F26B5/04
Domestic Patent References:
| JP2291128A | ||||
| JP480924A | ||||
| JP6254443A | ||||
| JP4354129A | ||||
| JP46830A |
Attorney, Agent or Firm:
Takeo Mamiya