To provide a treatment system for the object to be treated and a treatment method for the object to be treated where the amount of unrequired components (acids, bases or the like) generated when the object to be treated is heated (thermally decomposed) to generate a thermal decomposition gas is suppressed, or the generated unrequired components are removed, so that the remaining of the unrequired components is prevented.
The treatment system for the object to be treated is provided with a thermal decomposition mechanism 12, a reforming mechanism 16 provided at the poststage of the thermal decomposition mechanism 12 and a gas cleaning mechanism 18 provided at the poststages of the thermal decomposition mechanism 12 and the reforming mechanism 16. Further, a water quality sensor 36 of measuring the prescribed water quality of cleaning water in the gas cleaning mechanism 18 is provided, and the measured value in the water quality sensor 36 is fed to control units 20 and 22. The control units 20 and 22 control thermal decomposition in the thermal decomposition mechanism 12 or reforming in the reforming mechanism 16 based on the measured value of the water quality sensor 36.
AMAMIYA TAKASHI
YOSHIKAWA JUN
IMAI KIYOSHI
JPS5748380A | 1982-03-19 | |||
JP2003003177A | 2003-01-08 | |||
JP2000254669A | 2000-09-19 | |||
JP2003001041A | 2003-01-07 | |||
JP2001096260A | 2001-04-10 | |||
JPS5389877A | 1978-08-08 | |||
JPH11344213A | 1999-12-14 |
Hiroyuki Nagai
Junpei Okada
Hirohito Katsunuma