To provide a tuning fork type bending crystal vibrator wafer that allows an increase in the number of tuning fork type bending crystal vibrators to be produced and enhances productivity.

A tuning fork type bending crystal vibrator wafer 10 includes a plurality of tuning fork type bending crystal vibrators, a frame 20, and connection portions 30. Each of the plurality of tuning fork type bending crystal vibrators has: a base 111; two vibrating arms 112a and 112b that extend from the base 111 in an identical direction; a first support arm 113a that is positioned nearer a side where the vibrating arm 112a is provided and that extends from the base 111 in a direction perpendicular to the vibrating arms 112a and 112b; and a second support arm 113b that is positioned farther from the vibrating arms 112a and 112b than the first support arm 113a. The frame 20 is provided so as to surround the plurality of tuning fork type crystal vibrators. The connection portions 30 serve to connect the respective bases 111 of the tuning fork type bending crystal vibrators and the frame 20. In the frame 20, the first support arms 113a and the second support arms 113b, of the adjacent pairs of the tuning fork type bending crystal vibrators are spaced at predetermined intervals in a longitudinal direction of the vibrating arms 112a and 112b.