Title:
SOLDER BALL MOUNTING DEVICE
Document Type and Number:
Japanese Patent JP3123370
Kind Code:
B2
Abstract:
PURPOSE: To provide a solder ball mounting device which while fluidizing solder balls due to vibrating a container stagnated with the balls, sucks the balls in suction holes bored in the lower surface of a head and are mounted on a work, and prevents the suction in the head from being clogged by metallic powder, which is generated by fluidization and the rubbing of balls to each other.
CONSTITUTION: A container 12 for stagnating solder balls 1 is partitioned into an upper space T1 and a lower space T2 by a mesh 10 and the balls 1 are stagnated on the mesh 10. When a vibrator 19 is driven to vibrate the container 12 so that suction holes 29 the lower surface of a head 30 are easy to suck the balls 1 and the balls 1 are made to fluidize, the balls rub to each other and metallic powder K is generated, but as the powder K is sifted down in the space T2 by the mesh 10 being vibrated, the holes 29 are hardly clogged by the powder K.
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Inventors:
Shinichi Nakazato
Application Number:
JP29952894A
Publication Date:
January 09, 2001
Filing Date:
December 02, 1994
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
B23K3/06; H01L21/60; H01L21/677; H05K3/34; (IPC1-7): H01L21/60; H05K3/34
Domestic Patent References:
| JP5129374A | ||||
| JP2295186A | ||||
| JP58118131A |
Attorney, Agent or Firm:
Fumio Iwahashi (2 others)