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Title:
TWO-DIMENSIONAL PLANE CUTTING METHOD OPTIMIZING DEVICE
Document Type and Number:
Japanese Patent JP10015727
Kind Code:
A
Abstract:

To provide a device determining an optimum cutting method in a short time even in the case of large n value, relating to a two-dimensional plane cutting method optimizing device obtaining an optimum cutting method minimizing a waste area, in the case of cutting out a prescribed number of sheets of small planes from a number of n sheets of two-dimensional planes.

A two-dimensional plane cutting information acquisition part 2 acquires information of how to cut pattern or the like relating to cutting of a two-dimensional plane. In a fitness function setting part 3, a weight coefficient is set to a fitness function used in an optimization processing part 4. In the optimization processing part 4, based on information obtained from the plane cutting information acquisition part 2, a group of chromosome, represented by a row or the like of how to cut pattern number in accordance with each two-dimensional plane, is generated, by genetic algorithm, genetic operation of selection, crossing, sudden variation of the chromosome is repeated, optimum solution or that approximate to the optimum solution is obtained.


Inventors:
Tajima, Koji
Application Number:
JP1996000173559
Publication Date:
January 20, 1998
Filing Date:
July 03, 1996
Export Citation:
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Assignee:
FUJITSU LTD
International Classes:
B23Q15/00; B23D36/00; B26D5/00; G05B13/02; G06F15/18; G06N3/00; B23Q15/00; B23D36/00; B26D5/00; G05B13/02; G06F15/18; G06N3/00; (IPC1-7): B23D36/00; B23Q15/00; B26D5/00; G05B13/02; G06F15/18