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Title:
工業用二層織物
Document Type and Number:
Japanese Patent JP5777826
Kind Code:
B2
Abstract:
The object of the present invention is to form a joint loop structure using warps which form a surface of an industrial two-layer fabric of the contact-yarn binding type without independent binding yarns, at its both ends. The present invention includes the upper surface side warp serving as the warp fabric yarn-contact binding yarn is not woven into the upper surface side weft at one or more points of a complete structure, and extends toward the lower surface side instead and is woven into the lower surface side weft at the lower surface side, and then, extends toward the upper surface sides to be woven into other upper surface side weft, while, the lower surface side warp is not woven into the lower surface side weft at a point where the upper surface side warp serving as the warp fabric yarn-contact binding yarn is woven into the lower surface side weft at the lower surface side, and extends toward the upper surface side instead to be woven into the upper surface side weft which is not woven into the upper surface side warp, at the upper surface side, and then extends toward the lower surface side to be woven into other lower surface side weft. The industrial two-layer fabric forms a joint loop by at least one end portion of the warp being turned back at both end portions in its longitudinal direction, and at least a longitudinal yarn in a complete structure includes at least one warp which forms a pair arranged to be opposite to the warp which is turned back for forming the joint loop, and, in a longitudinal structure, the number of knuckles of one of the warps forming the pair is the same as that of the other of the warps forming the pair and distances between said adjacent knuckles are substantially common.

Inventors:
Toru Egawa
Fumihito Takahashi
Application Number:
JP2014554478A
Publication Date:
September 09, 2015
Filing Date:
December 25, 2013
Export Citation:
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Assignee:
Nippon Filcon Co., Ltd.
International Classes:
D21F1/10; D03D1/00; D03D11/00; D21F1/12; D21F7/08; D21F7/10
Domestic Patent References:
JP2006328585A
JP2009019282A
JP2008019521A
JP2007537371A
Attorney, Agent or Firm:
Jun Komatsu