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Patent Searching and Data


Title:
TWO-PACK REACTION CURING TYPE COMPOSITION AND BONDING METHOD USING THE SAME
Document Type and Number:
Japanese Patent JP2008248111
Kind Code:
A
Abstract:

To provide a method causing no spew from a bonding margin, capable of uniformly coating an adhesive and low in cost, in coating of a two-part curing type composition.

The two-part reaction curing type composition is provided, wherein the two parts are each held in the space in a vessel which is composed of a porous material having pores communicating the inside with the outside of the vessel and a wall comprising one or more selected from the group consisting of a resin, glass, wood and a metal, and a bonding method using the composition is provided.


Inventors:
WATANABE ATSUSHI
SUDO HIROSHI
Application Number:
JP2007091848A
Publication Date:
October 16, 2008
Filing Date:
March 30, 2007
Export Citation:
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Assignee:
DENKI KAGAKU KOGYO KK
International Classes:
C09J201/00; B43M11/06; B65D81/32; C09J4/02; C09J5/04