TWO-PACK TYPE HEAT CURABLE RESIN COMPOSITION, COATING FILM-FORMING METHOD AND COATED PRODUCT

Japanese Patent JP2005325247

A

To greatly reduce the curing time of an acid/epoxy curable coating (particularly reduce the curing time by half) and further improve other performances (particularly film performance).

The two-pack type heat curable resin composition comprises (a) an acrylic polycarboxylic acid having a half ester group obtained by copolymerizing an acid anhydride group-containing ethylencially unsaturated monomer and an acid anhydride group-free ethylenically unsaturated monomer, (b) a carboxyl group-containing polyester resin obtained by reacting a polyesterpolyol having three or more hydroxyl groups with an acid anhydride group-containing compound, (c) an acrylic resin having a hydroxyl group and an epoxy group obtained by copolymerizing a hydroxyl group-containing ethylenically unsaturated monomer, an epoxy group-containing ethylenically unsaturated monomer, and an ethylenically unsaturated monomer having neither a hydroxyl group nor an epoxy group, and (d) an acid anhydride group-containing compound.

TANABE HISANORI
TSUJIOKA HIDEAKI

JP2004145001A

November 24, 2005

May 14, 2004

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NIPPON PAINT CO LTD

B05D1/36; B05D7/24; C08K5/1539; C08L33/14; C08L35/00; C08L67/00; C09D7/12; C09D133/00; C09D135/00; C09D163/00; C09D167/00; (IPC1-7): C09D133/00; B05D1/36; B05D7/24; C08K5/1539; C08L33/14; C08L35/00; C08L67/00; C09D7/12; C09D135/00; C09D163/00; C09D167/00

JPH08259667A	1996-10-08
JPH09173956A	1997-07-08
JP2002179992A	2002-06-26
JPH08259667A	1996-10-08
JPH09173956A	1997-07-08
JP2002179992A	2002-06-26

Aoyama Aoi
Muneo Yamamoto
Yuko Goto

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