PURPOSE: To provide a two-side grinding machine for semi-conductor wafers etc. with good efficiency by installing a carrier equipped with a space for loading a work to be processed, interposed between an upper and a lower rotary disc, and by furnishing a supply device, a carrier driver and a takeout device.

CONSTITUTION: Loading and unloading of a work to be processed 1 into/out of a space 6a formed in a carrier 6A is made in the portions of spaces 6a, 6a' which are out of an upper 2 and a lower 3 rotary disc through the use of a suction arm 11 and a cylinder 16, so that works can be fed continuously into the gap between the two discs 2, 3, where they are ground continuously and taken out. Here each work 1 between the discs 2, 3 is ground while swung oscillatively and inverted by the above-mentioned carrier 6A, so that wear of a polishing cloth 7 set on the discs can be made even. Further the load given by a pressurization cylinder 20 shall be at a low pressure at the time of loading and unloading the work 1 so as to prevent damage of the work 1.