Title:
紫外線硬化型オルガノポリシロキサンゲル組成物、シリコーンゲル硬化物及びその製造方法並びに圧力センサー
Document Type and Number:
Japanese Patent JP6943297
Kind Code:
B2
Abstract:
An ultraviolet curable organopolysiloxane composition which contains:(A) a linear or branched organopolysiloxane which contains, as monovalent substituents bonded to a silicon atom at an end of the molecular chain, at least three groups represented by formula (1) and/or formula (2) in each molecule, while having the main chain composed of repeated diorganosiloxane units(in the formulae, a represents a number of 1-3; and the broken line represents a bonding hand);(B) a linear or branched organopolysiloxane which contains at least two groups represented by formula (3) in each molecule, while having the main chain composed of repeated diorganosiloxane units R1bR23-bSi- - - (3)(in the formula, R1represents an alkenyl group; R2represents a monovalent hydrocarbon group; and b represents a number of 1-3); and(C) a photoinitiator.With use of this ultraviolet curable organopolysiloxane composition, the hardness of a cured product obtained therefrom is easily controlled, and good surface curability and good curability in deep portions are achieved even in the presence of oxygen. Consequently, this ultraviolet curable organopolysiloxane composition enables the achievement of a silicone gel (a gel-like cured product) which has been cured at a substantially uniform crosslinking density (with a substantially uniform penetration) without depending on the irradiance of ultraviolet light (the amount of irradiation energy).
Inventors:
Tsuyoshi Matsuda
Takafumi Sakamoto
Takafumi Sakamoto
Application Number:
JP2019562879A
Publication Date:
September 29, 2021
Filing Date:
November 28, 2018
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
C08F299/08; G01L1/00
Domestic Patent References:
| JP2016056330A | ||||
| JP60118712A | ||||
| JP2017179083A | ||||
| JP2005144923A | ||||
| JP62212415A | ||||
| JP9077951A |
Foreign References:
| WO2009044885A1 |
Attorney, Agent or Firm:
Hideaki International Patent Office