Title:
ULTRA-FINE CONDUCTOR FOR WIRING MATERIAL IN MOVABLE PORTION
Document Type and Number:
Japanese Patent JP2000251530
Kind Code:
A
Abstract:
To greatly improve tensile strength and bending resistance without causing reduction in conductivity.
In this ultra-fine conductor 1 for wiring material in a movable portion, a copper alloy formed by adding from 0.025 wt.% to 0.15 wt.% Mg and less than 0.20 wt.% Sn to Cu is extended and machined to less than 0.08 mm element wire diameter to form ultra-fine element wires 2 whose tensile strength is higher than 70 kg/mm2 and conductivity is higher than 70% IACS, and a plurality of these ultra-fine element wires 2 are stranded. Thus, tensile strength and bending resistance can be greatly improved without causing reduction in conductivity, and therefore, break or buckling is not caused for heavy bending stress.
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Inventors:
ICHIKAWA TAKAO
MATSUI RYO
AOYAMA MASAYOSHI
UENO HITOSHI
MATSUI RYO
AOYAMA MASAYOSHI
UENO HITOSHI
Application Number:
JP4805999A
Publication Date:
September 14, 2000
Filing Date:
February 25, 1999
Export Citation:
Assignee:
HITACHI CABLE
International Classes:
H01B1/02; H01B5/08; (IPC1-7): H01B1/02; H01B5/08
Attorney, Agent or Firm:
Nobuo Kinutani