Title:
ULTRA HIGH VOID VOLUME POLISHING PAD WITH CLOSED PORE STRUCTURE
Document Type and Number:
Japanese Patent JP2019171567
Kind Code:
A
Abstract:
To provide a polishing pad for chemical-mechanical polishing comprising a porous polymeric material that provides effective removal rates, has extended pad life and allows limited scratching.SOLUTION: The polishing pad comprises closed pores and has a void volume fraction of 70% or more. The porous polymeric material forming the pad is formed from a polymer resin having a Shore D hardness according to ASTM D2240 of 15D to 75D. A method of preparing a polishing pad comprises: providing a polishing pad material comprising a polymer resin; exposing the polishing pad material to an inert gas at a first elevated pressure; foaming the polishing pad material by increasing the temperature of the polishing pad material to a first temperature above a glass transition temperature of the polishing pad material and below a melting temperature thereof; exposing the polishing pad material to an inert gas at a second elevated pressure; and foaming the polishing pad material by increasing the temperature of the polishing pad material to a second temperature above the glass transition temperature and below the melting temperature.SELECTED DRAWING: Figure 1C
Inventors:
GEORGE FOTOU
ACHLA KHANNA
ROBERT VACASSY
ACHLA KHANNA
ROBERT VACASSY
Application Number:
JP2019088323A
Publication Date:
October 10, 2019
Filing Date:
May 08, 2019
Export Citation:
Assignee:
CABOT MICROELECTRONICS CORP
International Classes:
B24B37/24; H01L21/304
Attorney, Agent or Firm:
Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Atsushi Ebiya
Naori Kota
Satoshi Deno
Kenji Kimura
Takashi Ishida
Tetsuji Koga
Atsushi Ebiya
Naori Kota
Satoshi Deno
Kenji Kimura