Title:
フェムト秒レーザーを用いた超精密ブレードエッジ加工方法
Document Type and Number:
Japanese Patent JP7040824
Kind Code:
B2
Abstract:
The present invention relates to a method for processing a superfine blade edge using a femtosecond laser, the method comprising: a step for primarily grinding a blade edge portion by using a grinding wheel; and a step for secondarily grinding at least a part of the blade edge portion by radiating a femtosecond laser in the lengthwise direction of the ground blade edge portion. The secondary grinding step comprises: a step for oscillating the femtosecond laser; a step for modifying energy distribution of the femtosecond laser; a step for increasing the size of the energy distribution of the femtosecond laser; a step for aligning the central portion of the energy distribution of the femtosecond laser to an end portion of the blade edge portion; a step for changing the proceeding direction of the femtosecond laser and radiating the femtosecond laser to the blade edge portion via a focusing lens; and a step for radiating the femtosecond laser after moving, in the lengthwise direction of the blade, a stage on which the blade is placed.
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Inventors:
Kim, Seong Hwan
Application Number:
JP2020572368A
Publication Date:
March 23, 2022
Filing Date:
May 22, 2019
Export Citation:
Assignee:
21TH CENTURY CO., LTD
International Classes:
B24B3/36; B23K26/02; B23K26/073; B23K26/36; B23P15/28; B24B49/12; B24B53/00
Domestic Patent References:
| JP2019042755A | ||||
| JP2016175141A | ||||
| JP2006239817A | ||||
| JP4240007A | ||||
| JP2015085336A | ||||
| JP2019523824A | ||||
| JP2006297458A |
Foreign References:
| US20040163262 |
Attorney, Agent or Firm:
Shin Shin