Title:
超薄形状のMEMSマイクロホン及びマイクロスピーカ
Document Type and Number:
Japanese Patent JP4675084
Kind Code:
B2
Abstract:
This disclosure encompasses a process for fabricating a MEMS device in which the thickness of a substrate is reduced and a carrier wafer is attached to one side of the substrate for at least a part of the process of fabricating the MEMS device. For example, a process of fabricating a plurality of devices containing MEMS membranes (sealed micro-machined meshes) may begin with certain process steps being performed from the top side of a substrate carrying the plurality of devices. A carrier wafer is attached to the top side of the substrate. The thickness of the substrate is reduced using any known technique. The fabrication process is continued by performing various process steps from the back side of the substrate. Alternatively, a process of fabricating a plurality of devices containing MEMS membranes may begin with attaching a carrier wafer to a top side of a substrate carrying the plurality of devices. The thickness of the substrate is reduced. Process steps are then performed from the back side of the substrate. A carrier wafer is attached to the back side of the substrate and the carrier wafer on the top side of the substrate is removed. Thereafter, process steps are performed from the top side of the substrate.
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Inventors:
Shu Chu
Raymond A. Siferno
Raymond A. Siferno
Application Number:
JP2004311920A
Publication Date:
April 20, 2011
Filing Date:
October 27, 2004
Export Citation:
Assignee:
Akustica,Inc.
International Classes:
B81C1/00; H01L21/00; H01L21/30; H01L21/301; H01L21/46; H04R19/00
Domestic Patent References:
| JP2001007346A | ||||
| JP2000315678A | ||||
| JP2002222961A | ||||
| JP4181136A | ||||
| JP2001518246A | ||||
| JP2006506237A | ||||
| JP2004223710A |
Foreign References:
| US20020197873 | ||||
| WO2001080286A2 |
Other References:
J. Bagdahn, H. Knoll, M. Wiemer, M. Petzold,A new approach for handling and transferring of thin semiconductor materials,Microsystem Technologies,2003年 1月,Volume 9, Number 3,pp. 204-209
Attorney, Agent or Firm:
Shinjiro Ono
Kazuo Shamoto
Yasushi Kobayashi
Akio Chiba
Hiroyuki Tomita
Takuto Tanaka
Kazuo Shamoto
Yasushi Kobayashi
Akio Chiba
Hiroyuki Tomita
Takuto Tanaka