To provide an ultra-thin copper foil with carrier, wherein an ultra-thin copper foil having minimized number of pinholes is formed, by plating, on a peeling layer that withstands high working temperature, and to provide a printed circuit board using the ultra-thin copper foil with carrier.

The method of manufacturing the ultra-thin copper foil with carrier includes: a step of film-forming the peeling layer on the surface of a carrier foil having a surface roughness Rz of 0.1 m to 5 m; a step of forming the ultra-thin copper foil on the peeling layer such that a surface roughness Rz of the carrier foil side becomes 0.1 m to 5 m; a step of film-forming a strike plating layer by using Cu or Cu alloy plating bath containing P such that at least 90% of the peeling layer surface is covered with a copper layer on the position set by adding 0.1 m to 0.2 m to the surface roughness Rz of the ultra-thin copper foil on the ultra-thin copper foil side than protrusion parts of surface ruggedness on the carrier foil side of the formed ultra-thin copper foil; and a step of forming a copper layer on the strike plating layer as an ultra-thin copper foil of a prescribed thickness.