To provide ultra-thin copper foil with a carrier which suppresses the generation of a blister at an interface of release layers, does not influence carrier peel, has a wide control range in the condition for producing the ultra-thin copper foil with the carrier, achieves stable production quality, is friendly to an environment, and enables the easy peeling of the ultra-thin copper foil from the carrier foil even in a high-temperature environment.
The ultra-thin copper foil with the carrier includes carrier foil, a diffusion prevention layer, a release layer, and ultra-thin copper foil. The release layer includes two layers each having a different composition ratio of metal A to metal B, the metal A selected from the group of Mo, Ta, V, Mn, and W, and the metal B selected from the group of Fe, Co, Ni, and Cr. Here, the following expression for percentage is satisfied: |(c/c+d)-(e/e+f)|*100≥3(%), wherein c and d represent the content of metal A and metal B which constitute the release layer at the side of the carrier foil, respectively, and e and f represent the content of metal A and metal B which constitute the release layer at the side of the ultra-thin copper foil, respectively.
MOGI TAKASANE
HOSHINO KAZUHIRO
FUJISAWA SATORU
KAWAKAMI AKIRA
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