Ultra-thin copper foil with carrier and its manufacturing method

Japanese Patent JP6352449

B2

Provided is an ultrathin copper foil with carrier capable of obtaining both microcircuit formability and laser processability, from the machining of a copper-clad laminate to the manufacture of a printed wiring board. This ultrathin copper foil with carrier is provided with a carrier foil, a release layer, and an ultrathin copper foil in the stated order. The surface of the ultrathin copper foil on the release layer side has an average distance (peak spacing) between surface peaks of 20 μm or less, and the surface of the ultrathin copper foil on the side opposite from the release layer has a maximum waviness elevation difference (Wmax) of 1.0 μm or less.

JP6872947	A method for manufacturing a copper foil with a carrier, a laminate, a method for manufacturing a copper foil with a carrier, a method for manufacturing a laminate, a method for manufacturing a printed wiring board, and a method for manufacturing an electronic device.
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Toru Hanada
High Pear Satoshi
Tetsuhiro Matsunaga
Ayumu Tateoka

JP2016570671A

July 04, 2018

January 20, 2016

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Mitsui Mining & Smelting Co., Ltd.

C25D1/04; B32B7/06; B32B15/20; C25D5/16; C25D7/06; H05K1/09

JP2005161840A
JP2009176768A
JP2013019056A
JP2014208910A

WO2014133164A1
WO2012046804A1

Masaharu Takamura
Hiroki Kashima
Taku Takeishi

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