Title:
キャリア付極薄銅箔、その製造方法、銅張積層板及びプリント配線板
Document Type and Number:
Japanese Patent JP6650923
Kind Code:
B2
Abstract:
Provided is an ultra-thin copper foil with a carrier by which it is possible to achieve both laser beam drilling workability and fine circuit formability, in terms of working a copper-clad laminate or manufacturing a printed circuit board. An ultra-thin copper foil with a carrier according to the present invention is provided with a carrier foil, a separation layer, and an ultra-thin copper foil in this order. The surface of the ultra-thin copper foil on the side thereof closest to the separation layer has an average distance between front-surface peaks (Peak Spacing) in the range of 2.5 to 20.0 μm, and a level difference in a core part (core roughness depth) Rk in the range of 1.5 to 3.0 μm. The undulations on the surface of the ultra-thin copper foil on the side opposite to the separation layer have a maximum elevation level difference Wmax of 4.0 μm or less.
Inventors:
Daisuke Nakajima
Toru Hanada
Yoshikawa Kazuhiro
Yoshinori Shimizu
Toru Hanada
Yoshikawa Kazuhiro
Yoshinori Shimizu
Application Number:
JP2017507639A
Publication Date:
February 19, 2020
Filing Date:
February 29, 2016
Export Citation:
Assignee:
Mitsui Mining & Smelting Co., Ltd.
International Classes:
B32B15/01; B32B15/08; H05K1/09; H05K3/46
Domestic Patent References:
| JP200168816A | ||||
| JP2004263296A | ||||
| JP2013147755A | ||||
| JP2012169598A | ||||
| JP2013213250A | ||||
| JP201460407A |
Foreign References:
| WO2016121972A1 |
Attorney, Agent or Firm:
Masaharu Takamura
Hiroki Kashima
Taku Takeishi
Hiroki Kashima
Taku Takeishi