Title:
キャリア箔付き極薄銅箔
Document Type and Number:
Japanese Patent JP7083845
Kind Code:
B2
Abstract:
The carrier-foil-attached ultra-thin copper foil according to one embodiment of the present invention comprises a carrier foil, a release layer, a first ultra-thin copper foil, a Cu-diffusion prevention layer, an Al layer, and a second ultra-thin copper foil, wherein the release layer may comprise a first metal (A2) having peeling properties, and a second metal (B2) and third metal (C2) facilitating the plating of the first metal (A2).
Inventors:
Pom Won Chin
Lee Sung Hyun
Choi Woong
Song Kitoku
Kim Hyun Chul
Lee Sung Hyun
Choi Woong
Song Kitoku
Kim Hyun Chul
Application Number:
JP2019559246A
Publication Date:
June 13, 2022
Filing Date:
January 15, 2018
Export Citation:
Assignee:
ILJIN MATERIALS CO., LTD.
International Classes:
C23C28/00; B32B7/06; B32B15/01; C25D1/04; C25D5/14; H01L21/60; H01L23/12; H01L23/14; H05K1/09
Domestic Patent References:
| JP2001196738A |
Foreign References:
| KR1020140023744A |
Attorney, Agent or Firm:
Aoki Atsushi
Shinji Mihashi
Junichi Tsuruta
Tomohiro Nanzan
Youichi Watanabe
Naonori Koda
Shinji Mihashi
Junichi Tsuruta
Tomohiro Nanzan
Youichi Watanabe
Naonori Koda