Title:
キャリア付き極薄銅箔、並びに銅貼積層板またはプリント配線基板
Document Type and Number:
Japanese Patent JP5959149
Kind Code:
B2
Abstract:
The invention has as its object to provide an ultra-thin copper foil with a carrier which suppresses occurrence of blistering and is stable in peeling strength, in particular provides an ultra-thin copper foil with a carrier enabling easy peeling of a carrier foil from an ultra-thin copper foil even under a high temperature environment. As means for that, there is provided an ultra-thin copper foil with a carrier comprised of a carrier foil, a release layer, and a copper foil, wherein the release layer is formed by a first release layer disposed on the carrier foil side and a second release layer disposed on the ultra-thin copper foil side, there is a first interface between the carrier foil and the first release layer, a second interface between the ultra-thin copper foil and the second release layer, and a third interface between the first release layer and the second release layer, and the peeling strengths at the interfaces are first interface > third interface, and second interface > third interface.
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Inventors:
Takeo Uno
Akira Kawakami
Yuji Suzuki
Akira Kawakami
Yuji Suzuki
Application Number:
JP2010527833A
Publication Date:
August 02, 2016
Filing Date:
September 04, 2009
Export Citation:
Assignee:
THE FURUKAW ELECTRIC CO.,LTD.
International Classes:
C25D7/06; B32B7/02; B32B15/01; B32B15/08; C25D1/20; H05K1/09
Domestic Patent References:
| JP2002368365A | 2002-12-20 | |||
| JP2004169181A | 2004-06-17 | |||
| JP2005502496A | 2005-01-27 | |||
| JP2007186781A | 2007-07-26 | |||
| JP2007186782A | 2007-07-26 |
Foreign References:
| WO2006013735A1 | 2006-02-09 | |||
| WO2002024444A1 | 2002-03-28 |
Attorney, Agent or Firm:
Takahisa Sato