Title:
超音波アレイ振動子、超音波アレイ振動子の製造方法、超音波プローブ及び超音波診断装置
Document Type and Number:
Japanese Patent JP6787327
Kind Code:
B2
Abstract:
[Object] To provide an ultrasonic array oscillator, a method of producing an ultrasonic array oscillator, an ultrasonic probe, and an ultrasonic diagnostic apparatus having a high impedance matching effect and excellent productivity. [Solving Means] The ultrasonic array oscillator according to the present technology includes ultrasonic oscillators (130) and semiconductor chips (140). The ultrasonic oscillators (130) form an array. The semiconductor chips (140) are bonded to the respective ultrasonic oscillators (130) to form impedance matching circuits.
Inventors:
Kind of Morimoto
Application Number:
JP2017538845A
Publication Date:
November 18, 2020
Filing Date:
June 16, 2016
Export Citation:
Assignee:
ソニー株式会社
International Classes:
A61B8/00; H01L41/09; H01L41/113; H01L41/311; H04R3/00; H04R17/00; H04R31/00
Domestic Patent References:
| JP2006166443A | ||||
| JP4148859A | ||||
| JP2002027594A |
Foreign References:
| EP0818772A2 | ||||
| EP2685255A2 |
Attorney, Agent or Firm:
Junichi Omori
Mitsuru Takahashi
Teppei Nakamura
Ori Akira
Masayoshi Sekine
Ayako Kaneko
Shintaro Kanayama
Chiba Ayako
Shiraka Tomohisa
Mitsuru Takahashi
Teppei Nakamura
Ori Akira
Masayoshi Sekine
Ayako Kaneko
Shintaro Kanayama
Chiba Ayako
Shiraka Tomohisa