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Title:
ULTRASONIC ARRAY SENSOR AND MANUFACTURING METHOD OF THE SAME
Document Type and Number:
Japanese Patent JP2013179404
Kind Code:
A
Abstract:

To provide an ultrasonic array sensor which inhibits characteristic vibrations between multiple sensor elements and obtains desired yield, and to provide a manufacturing method of the ultrasonic array sensor.

In an ultrasonic array sensor having multiple sensor elements 2, each sensor element 2 has a recessed part 10 formed at an insulation film 22 and protection films located on the recessed part 10 and a bottom layer of a diaphragm 9. A lower electrode 28a, a piezoelectric body layer 29, and an upper electrode 30a are formed on the diaphragm 9. A cavity 12 is formed in the recessed part 10, and a hole 11 is formed in the cavity 12 so as to penetrate through the diaphragm 9.


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Inventors:
OOTO KENICHI
Application Number:
JP2012041226A
Publication Date:
September 09, 2013
Filing Date:
February 28, 2012
Export Citation:
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Assignee:
SEIKO EPSON CORP
International Classes:
H04R17/00; A61B8/00; H04R31/00
Domestic Patent References:
JP2005051690A2005-02-24
JP2008109573A2008-05-08
JP2008074020A2008-04-03
JP2011124973A2011-06-23
JP2005051690A2005-02-24
JP2008109573A2008-05-08
JP2008074020A2008-04-03
Foreign References:
WO2007119643A12007-10-25
Attorney, Agent or Firm:
Masahiko Ueyanagi
Osamu Suzawa
Kazuhiko Miyasaka



 
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