To prolong the service life of a suction member by previously preventing wear and damage of the suction member by confirming the state of a suction surface of the suction member in time.
The ultrasonic bonding apparatus is provided with the suction member 19 provided with the suction surface 191 having a surface subjected to resin coating; a workpiece holding means 2 provided so as to be opposite to the suction surface 191 of the suction member 19; a compression bonding means for compression-bonding a chip component sucked and held by the suction means 19 on a workpiece 1 held in the workpiece holding means 2; and a vibration providing means for providing ultrasonic vibration of a direction along a direction perpendicular to the thickness direction of the chip component and the workpiece 1, to the suction member 19 while performing the compression bonding. The apparatus is provided with an imaging means 10a to be arranged so that the suction surface 191 of the suction member 19 can be imaged; and an image processing means for performing image processing of image data of the suction surface 191 acquired by the imaging means 10a.
IMAI KOICHI
KAWAKAMI MIKIO
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