Title:
超音波接合装置および超音波接合方法
Document Type and Number:
Japanese Patent JP7159626
Kind Code:
B2
Abstract:
An ultrasonic bonding device includes a stage and an ultrasonic horn. A first flat member and a second flat member to be bonded are placed on the stage. The ultrasonic horn includes a press part to be pressed on a laminated portion of the first flat member and the second flat member. The stage includes a lower-side surface, a higher-side surface, and a step wall surface. The first flat member is to be placed on the lower-side surface. The higher-side surface is positioned higher than the lower-side surface by a predetermined step height. The second flat member is to be placed on the higher-side surface. The step wall surface is positioned in a boundary between the lower-side surface and the higher-side surface.
Inventors:
Seijuro Sunaga
Miyagoshi Toshinori
Mitsuyoshi Makita
Miyagoshi Toshinori
Mitsuyoshi Makita
Application Number:
JP2018109768A
Publication Date:
October 25, 2022
Filing Date:
June 07, 2018
Export Citation:
Assignee:
tdk Corporation
International Classes:
B23K20/10; B06B3/00; H01L21/60; H01L21/607
Domestic Patent References:
| JP5115986A | ||||
| JP2008296161A | ||||
| JP2014072270A |
Foreign References:
| US20130112735 |
Attorney, Agent or Firm:
Maeda Suzuki International Patent Attorneys Corporation