Title:
超音波複合振動加工装置
Document Type and Number:
Japanese Patent JP6673961
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an ultrasonic complex vibration processing device that performs ultrasonic welding and ultrasonic machining such as cutting by driving a vibration tool along a circular or elliptical vibrational trajectory or applying secondary vibration stress to metal and ceramic materials.SOLUTION: An ultrasonic complex vibration processing device includes a complex bending vibration tool that comprises: a replaceable resonance-type holder 1" that is installed in the state of making an end joint surface adhere closely to the tip joint surface via a fastening screw 2, on a tip joint surface of a complex vibration transducer 7 having a driving source for drive provided at a back end; and a complex bending vibration rod 1' having a tip vibrated with a vibration length of at least several wavelengths along a trajectory from a circular trajectory to an elliptical trajectory, that is, the complex bending vibration rod 1' joined to the opposite side of the joint surface of the holder 1".SELECTED DRAWING: Figure 1
Inventors:
Jiromaru Tsujino
Application Number:
JP2018059131A
Publication Date:
April 01, 2020
Filing Date:
March 27, 2018
Export Citation:
Assignee:
Jiromaru Tsujino
International Classes:
B23K20/10; B06B1/02; B06B1/06
Domestic Patent References:
| JP629357A | ||||
| JP2009113083A | ||||
| JP2011578A | ||||
| JP2004283792A | ||||
| JP63242479A | ||||
| JP8264597A | ||||
| JP479634B1 |
Attorney, Agent or Firm:
Morinosuke Higuchi