Title:
超音波カッター装置
Document Type and Number:
Japanese Patent JP7121385
Kind Code:
B2
Abstract:
To efficiently cut a target object 7 in which a second target object 7b having different hardness is mixed in a first target object 7a, like a cake with strawberry in it.SOLUTION: An ultrasonic cutter device is configured such that: a handle part 4b is projected on a flat surface on which an edge 5a of a cutter vibrates, outside a housing 4 of ultrasonic vibration means 1 with which a cutter 5 is integrally connected; a pressure-receiving part 4d for receiving external force in a direction crossing a length direction of the edge 5a of the cutter is provided on the surface of the handle part 4b, at a position separated by a prescribed distance (e) from the center in the length direction of the edge 5a of the cutter; the edge 5a is moved toward and brought into contact with a target object 7 in a state of supporting the housing 4 attached to the ultrasonic vibrator 1 on the handle part 4b; and when external force (F) is applied to the pressure-receiving part 4d of the handle part, the edge 5a is inclined on the flat surface where the edge 5a vibrates due to the couple of force of reaction force received from the surface of the cut object 7 and external force, and the edge 5a cuts the target object 7 while changing a position that hits on the surface of the target object 7 and a contact angle.SELECTED DRAWING: Figure 4
Inventors:
Yasuhiro Yamamoto
Naokazu Nagasawa
Naokazu Nagasawa
Application Number:
JP2018099649A
Publication Date:
August 18, 2022
Filing Date:
May 24, 2018
Export Citation:
Assignee:
Seidensha Electronics Industry Co., Ltd.
International Classes:
B26D7/08; B26D1/06; B26D3/00
Domestic Patent References:
| JP2008030251A | ||||
| JP6074583B1 | ||||
| JP55021832U |
Attorney, Agent or Firm:
Naoki Maekawa