Title:
ULTRASONIC ELEMENT ARRAY, ULTRASONIC PROBE, ULTRASONIC DEVICE, AND MANUFACTURING METHOD FOR ULTRASONIC ELEMENT ARRAY
Document Type and Number:
Japanese Patent JP2017163183
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an ultrasonic element array that can have higher resistance against moisture and voltage even in a layout where wires intersect.SOLUTION: An ultrasonic element array 1 includes: a first piezoelectric element 3, a second piezoelectric element 4, a third piezoelectric element 5, and a fourth piezoelectric element 6 in each of which a piezoelectric body 16 is held between a first electrode 12 and a second electrode 13; a first wire 8 connecting between the second electrode 13 of the first piezoelectric element 3 and the second electrode 13 of the second piezoelectric element 4; a second wire 9 connecting between the second electrode 13 of the third piezoelectric element 5 and the second electrode 13 of the fourth piezoelectric element 6; a third wire 10b connecting to the second wire 9 over the first wire 8; and an insulating film 21 positioned between the first wire 8 and the third wire 10b. The insulating film 21 includes an inorganic insulating film 7 formed of an inorganic substance and an organic insulating film 18 formed of an organic substance. The inorganic insulating film 7 covers the piezoelectric elements.SELECTED DRAWING: Figure 1
Inventors:
KOJIMA CHIKARA
Application Number:
JP2016043086A
Publication Date:
September 14, 2017
Filing Date:
March 07, 2016
Export Citation:
Assignee:
SEIKO EPSON CORP
International Classes:
H04R17/00; A61B8/14; G01N29/22; H04R31/00
Attorney, Agent or Firm:
Kazuaki Watanabe
Keisuke Nishida
Satoshi Nakai
Keisuke Nishida
Satoshi Nakai
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