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Patent Searching and Data


Title:
ULTRASONIC MATERIAL EVALUATION METHOD AND DEVICE
Document Type and Number:
Japanese Patent JP2006064574
Kind Code:
A
Abstract:

To provide an ultrasonic material evaluation device capable of picturizing nondestructively a microscopic structure, an inclusion, a microscopic crack or the like, and detecting and evaluating it.

This ultrasonic material evaluation device includes a signal generator, a high output amplifier, a transmission ultrasonic probe, a scanning mechanism, a reception ultrasonic probe, a high-pass filter or a band-pass filter, a digital waveform storage part, an amplifier, and a computer. In the device, a signal from the signal generator is amplified by the high output amplifier by using a reflection method or a transmission method, and the transmission ultrasonic probe is excited, and a signal from the reception ultrasonic probe is amplified through the high-pass filter or the band-pass filter and then recorded with or without synchronous addition to a digital waveform recording means, and the recorded waveform is processed by digital waveform analysis by using a personal computer, and thereby a nonlinear characteristic of a waveform deformation, a harmonic vibration or the like can be determined and picturized. Hereby, a microscopic structure, an inclusion, a microscopic crack or the like of an industrial material or the like can be picturized nondestructively, detected and evaluated.


Inventors:
KAWASHIMA KOICHIRO
MURASE MORIMASA
Application Number:
JP2004248777A
Publication Date:
March 09, 2006
Filing Date:
August 27, 2004
Export Citation:
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Assignee:
CHOONPA ZAIRYO SHINDAN KENKYUS
International Classes:
G01N29/44
Attorney, Agent or Firm:
Kazushi Imasaki