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Title:
超音波探触子及びその製造方法
Document Type and Number:
Japanese Patent JP5095593
Kind Code:
B2
Abstract:
In an ultrasonic probe in which individual wires led out from multilayered piezoelectric elements are arranged in a staggered manner, short-circuit is prevented. Each of the elements includes: a multilayered structure in which piezoelectric material layers and at least one internal electrode are stacked; first and second flat electrodes; first and second side electrodes; an insulating film formed at a second side surface side of the multilayered structure; a wiring member bonded to the first flat electrode on the one end of the multilayered structure by using a conducting adhesive material; and the wiring member is provided at the second side surface side of the multilayered structure and the insulating film electrically separates the second side electrode and the conducting adhesive material in a first element, and the wiring member is provided at a first side surface side of the multilayered structure in a second element.

Inventors:
Ryuichi Nakayama
Atsushi Osawa
Application Number:
JP2008304103A
Publication Date:
December 12, 2012
Filing Date:
November 28, 2008
Export Citation:
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Assignee:
FUJIFILM Corporation
International Classes:
B06B1/06; A61B8/00; G01N29/24; H02N2/00; H04R17/00; H04R31/00
Domestic Patent References:
JP2007273584A
JP1077297A
JP3270500A
JP1236900A
JP63212299A
JP9139998A
JP62140451U
JP2004104629A
JP2007095991A
JP2001328867A
JP5153695A
Attorney, Agent or Firm:
Masaaki Utsunomiya
Atsushi Watanabe



 
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